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Indicative FOB price in USD. Volume, Incoterm and specification affect the final quotation.
Skived-fin copper · 0.08 °C/W · leak-tested at 6 bar
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Direct-to-chip cold plate tuned for 700–1000 W TDP accelerators. Skived copper micro-fin array over a vapour-blasted mating surface, EPDM seal and stainless quick-disconnect ports. Custom die footprints and manifold routings are tooled in 3 weeks.
| Capacity | 700–1,000 W TDP per die |
|---|---|
| Materials | Skived copper · EPDM seal · SS316 fittings |
| Type | Direct-to-chip · single/two-phase ready |
| Pressure | Tested at 6 bar · working 2.5 bar |
| Flow rate | 1.5–3.0 L/min at 0.08 °C/W |
| Compatibility | OEM GPU/CPU footprints · custom tooling 3 weeks |
| Warranty | 2 years |
Blind-mate UQD · zero-drip on disconnect · 2U rear mount
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3,000 kg static load · 78% airflow · tool-free rails